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WIP: mb: more shuffling

This commit is contained in:
Lukas F. Hartmann 2023-08-25 20:36:29 +02:00
parent 77575c82f8
commit b85e55da1d
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GPG Key ID: 376511EB67AD7BAF
9 changed files with 200119 additions and 194955 deletions
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51000
pocket-reform-motherboard/3d-models/105450-0101.step Normal file
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pocket-reform-motherboard/3d-models/SM04B-SRSS-TB(LF)(SN)--3DModel-STEP-56544.STEP Normal file
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pocket-reform-motherboard/3d-models/TSM-103-01-L-DH.step Normal file
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pocket-reform-motherboard/3d-models/TSM-106-02-X-SH-A.step Normal file
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pocket-reform-motherboard/footprints/MOLEX_105450-0101.kicad_mod Normal file
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(footprint MOLEX_105450-0101 (layer F.Cu) (tedit 64E8BD17)
(descr "")
(attr smd)
(fp_text reference REF** (at -1.899125 -5.722835 0) (layer F.SilkS)
(effects (font (size 1.0035984252 1.0035984252) (thickness 0.15)))
)
(fp_text value MOLEX_105450-0101 (at 5.748805 5.717805 0) (layer F.Fab)
(effects (font (size 1.00350393701 1.00350393701) (thickness 0.15)))
)
(pad A1 smd rect (at -3.0 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
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(pad A4 smd rect (at -1.5 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A5 smd rect (at -1.0 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A6 smd rect (at -0.5 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A7 smd rect (at 0.5 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A8 smd rect (at 1.0 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A9 smd rect (at 1.5 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A10 smd rect (at 2.0 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A11 smd rect (at 2.5 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad A12 smd rect (at 3.0 -3.77) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B1 smd rect (at 3.1 -2.47) (size 1.0 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B2 smd rect (at 2.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B3 smd rect (at 1.75 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B4 smd rect (at 1.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B5 smd rect (at 0.75 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B6 smd rect (at 0.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B7 smd rect (at -0.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B8 smd rect (at -0.75 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B9 smd rect (at -1.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B10 smd rect (at -1.75 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B11 smd rect (at -2.25 -2.47) (size 0.3 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad B12 smd rect (at -3.1 -2.47) (size 1.0 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.0762))
(pad S1 thru_hole oval (at -4.32 -3.36) (size 1.1 2.2) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
(pad S2 thru_hole oval (at 4.32 -3.36) (size 1.1 2.2) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
(pad S3 thru_hole oval (at -4.32 2.0) (size 1.3 2.6) (drill oval 0.6 2.1) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
(pad S4 thru_hole oval (at 4.32 2.0) (size 1.3 2.6) (drill oval 0.6 2.1) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
(zone (net 0) (net_name "") (layer F.Cu) (hatch full 0.508)
(connect_pads (clearance 0))
(min_thickness 0.01)
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
(xy -3.50081 -1.88)
(xy 3.5 -1.88)
(xy 3.5 3.77087)
(xy -3.50081 3.77087)
)
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(fp_line (start -4.47 3.95) (end 4.47 3.95) (layer F.Fab) (width 0.127))
(fp_line (start 4.47 3.95) (end 4.47 -3.95) (layer F.Fab) (width 0.127))
(fp_line (start 4.47 -3.95) (end -4.47 -3.95) (layer F.Fab) (width 0.127))
(fp_line (start -4.47 -3.95) (end -4.47 3.95) (layer F.Fab) (width 0.127))
(fp_line (start -5.22 -4.71) (end 5.22 -4.71) (layer F.CrtYd) (width 0.05))
(fp_line (start 5.22 -4.71) (end 5.22 4.2) (layer F.CrtYd) (width 0.05))
(fp_line (start 5.22 4.2) (end -5.22 4.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.22 4.2) (end -5.22 -4.71) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.47 3.77) (end 4.47 3.77) (layer F.SilkS) (width 0.127))
(fp_line (start -4.47 0.3) (end -4.47 -1.9) (layer F.SilkS) (width 0.127))
(fp_line (start 4.47 0.3) (end 4.47 -1.9) (layer F.SilkS) (width 0.127))
(zone (net 0) (net_name "") (layers *.Cu) (hatch full 0.508)
(connect_pads (clearance 0))
(min_thickness 0.01)
(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour allowed) (footprints allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
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(xy 3.5 -1.88)
(xy 3.5 3.7726)
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)
)
)
)

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pocket-reform-motherboard/footprints/SAMTEC_TSM-103-01-L-DH.kicad_mod Normal file
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(footprint SAMTEC_TSM-103-01-L-DH (layer F.Cu) (tedit 64E8936E)
(descr "")
(attr smd)
(fp_text reference REF** (at -1.635 -8.995 0) (layer F.SilkS)
(effects (font (size 1.0 1.0) (thickness 0.15)))
)
(fp_text value SAMTEC_TSM-103-01-L-DH (at 9.16 11.95 0) (layer F.Fab)
(effects (font (size 1.0 1.0) (thickness 0.15)))
)
(pad 01 smd rect (at 2.54 4.305) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 02 smd rect (at 2.54 8.495) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 03 smd rect (at 0.0 4.305) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 04 smd rect (at 0.0 8.495) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 05 smd rect (at -2.54 4.305) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 06 smd rect (at -2.54 8.495) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(fp_line (start -3.81 1.27) (end -3.81 -1.27) (layer F.Fab) (width 0.1))
(fp_line (start -3.81 -1.27) (end 3.81 -1.27) (layer F.Fab) (width 0.1))
(fp_line (start 3.81 -1.27) (end 3.81 1.27) (layer F.Fab) (width 0.1))
(fp_line (start 3.81 1.27) (end -3.81 1.27) (layer F.Fab) (width 0.1))
(fp_line (start -3.81 1.27) (end -3.81 -7.11) (layer F.Fab) (width 0.1))
(fp_line (start -3.81 -7.11) (end 3.81 -7.11) (layer F.Fab) (width 0.1))
(fp_line (start 3.81 -7.11) (end 3.81 1.27) (layer F.Fab) (width 0.1))
(fp_line (start -3.81 1.27) (end -3.81 -1.27) (layer F.SilkS) (width 0.2))
(fp_line (start 3.81 -1.27) (end 3.81 1.27) (layer F.SilkS) (width 0.2))
(fp_line (start 3.81 -1.27) (end -3.81 -1.27) (layer F.SilkS) (width 0.2))
(fp_line (start 3.81 1.27) (end -3.81 1.27) (layer F.SilkS) (width 0.2))
(fp_line (start -4.06 10.335) (end -4.06 -7.36) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.06 -7.36) (end 4.06 -7.36) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.06 -7.36) (end 4.06 10.335) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.06 10.335) (end -4.06 10.335) (layer F.CrtYd) (width 0.05))
(fp_circle (center 4.46 4.305) (end 4.56 4.305) (layer F.SilkS) (width 0.2))
(fp_circle (center 4.46 4.305) (end 4.56 4.305) (layer F.Fab) (width 0.2))
)

38
pocket-reform-motherboard/footprints/SAMTEC_TSM-106-02-X-SH-A.kicad_mod Normal file
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(footprint SAMTEC_TSM-106-02-X-SH-A (layer F.Cu) (tedit 64E89493)
(descr "")
(attr smd)
(fp_text reference REF** (at -4.325 8.365 0) (layer F.SilkS)
(effects (font (size 1.0 1.0) (thickness 0.15)))
)
(fp_text value SAMTEC_TSM-106-02-X-SH-A (at 7.74 9.865 0) (layer F.Fab)
(effects (font (size 1.0 1.0) (thickness 0.15)))
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(pad 01 smd rect (at -6.35 5.28) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 02 smd rect (at -3.81 5.28) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 06 smd rect (at 6.35 5.28) (size 1.27 3.18) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad None np_thru_hole circle (at -5.08 0.0) (size 1.78 1.78) (drill 1.78) (layers *.Cu *.Mask))
(pad None np_thru_hole circle (at 5.08 0.0) (size 1.78 1.78) (drill 1.78) (layers *.Cu *.Mask))
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(fp_line (start -7.87 -9.65) (end -7.87 7.12) (layer F.CrtYd) (width 0.05))
(fp_line (start -7.87 7.12) (end 7.87 7.12) (layer F.CrtYd) (width 0.05))
(fp_line (start 7.87 7.12) (end 7.87 -9.65) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.67 -9.4) (end 6.67 -9.4) (layer F.Fab) (width 0.1))
(fp_circle (center -8.29 5.28) (end -8.19 5.28) (layer F.Fab) (width 0.2))
(fp_circle (center -8.29 5.28) (end -8.19 5.28) (layer F.SilkS) (width 0.2))
(fp_line (start -6.67 -1.27) (end -6.67 -9.4) (layer F.Fab) (width 0.1))
(fp_line (start 6.67 -1.27) (end 6.67 -9.4) (layer F.Fab) (width 0.1))
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319976
pocket-reform-motherboard/pocket-reform-motherboard.kicad_pcb
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pocket-reform-motherboard/pocket-reform-motherboard.kicad_sch
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