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WIP: mb: pushing things around

This commit is contained in:
Lukas F. Hartmann 2023-08-25 12:21:09 +02:00
parent 095d9116b9
commit 77575c82f8
1 changed files with 34 additions and 76 deletions
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110
pocket-reform-motherboard/pocket-reform-motherboard.kicad_pcb
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@ -3324,7 +3324,7 @@
(footprint "Connector_JST:JST_SH_SM04B-SRSS-TB_1x04-1MP_P1.00mm_Horizontal" (layer "F.Cu")
(tstamp 00000000-0000-0000-0000-000061019792)
(at 178.1 70.2 180)
(at 166.6 63.5 180)
(descr "JST SH series connector, SM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
(tags "connector JST SH top entry")
(property "Checked" "y")
@ -3756,7 +3756,7 @@
(footprint "Connector_JST:JST_SH_SM04B-SRSS-TB_1x04-1MP_P1.00mm_Horizontal" (layer "F.Cu")
(tstamp 00000000-0000-0000-0000-000062296656)
(at 170.2 70.2 180)
(at 97.6 63.2 180)
(descr "JST SH series connector, SM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
(tags "connector JST SH top entry")
(property "LCSC" "")
@ -4850,7 +4850,7 @@
(footprint "footprints:WA-SMSI-M2" (layer "F.Cu")
(tstamp 0fef6438-ab4b-4dd8-b342-89a09c8e4fd0)
(at 156 67)
(at 151.8 67)
(property "Checked" "y")
(property "DNP" "")
(property "Distributor" "None")
@ -6894,48 +6894,6 @@
)
)
(footprint "footprints:WA-SMSI-M2" (layer "F.Cu")
(tstamp 32ec682e-92fa-4e37-bd51-94d31cc742bb)
(at 156 107)
(property "Checked" "y")
(property "DNP" "")
(property "Distributor" "None")
(property "LCSC" "C2915626")
(property "Manufacturer" "Wurth")
(property "Manufacturer_Name" "Sinhoo")
(property "Manufacturer_No" "SMTSO2020CTJ")
(property "Manufacturer_Part_Number" "SMTSO2020MTJ")
(property "Sheetfile" "pocket-reform-motherboard.kicad_sch")
(property "Sheetname" "")
(property "ki_description" "Mounting Hole with connection")
(property "ki_keywords" "mounting hole")
(path "/8360fd36-aa4d-4ab4-ad79-7e2b65e725c6")
(attr through_hole)
(fp_text reference "H6" (at 0.05 -3.3 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp bde7546a-99bc-465d-a698-733533d993b9)
)
(fp_text value "NGFF-Mount1" (at 0 3.2) (layer "F.Fab")
(effects (font (size 0.3 0.3) (thickness 0.05)))
(tstamp 1b585d08-daf0-4aa6-a3b1-3dfc0864b59f)
)
(fp_arc (start -1.900342 -0.600104) (mid -1.411908 -1.411844) (end -0.6 -1.9)
(stroke (width 0.9) (type solid)) (layer "F.Paste") (tstamp 5042a340-879c-4a8e-b7c6-ccd9d8a5134c))
(fp_arc (start -0.600104 1.900342) (mid -1.411844 1.411908) (end -1.9 0.6)
(stroke (width 0.9) (type solid)) (layer "F.Paste") (tstamp ff45f5ce-6d01-4803-880f-3fe61fd02909))
(fp_arc (start 0.600104 -1.900342) (mid 1.411844 -1.411908) (end 1.9 -0.6)
(stroke (width 0.9) (type solid)) (layer "F.Paste") (tstamp 3efd152e-4e9d-4712-a880-70dcc22e2092))
(fp_arc (start 1.900342 0.600104) (mid 1.411908 1.411844) (end 0.6 1.9)
(stroke (width 0.9) (type solid)) (layer "F.Paste") (tstamp 9f7921d5-7a5e-4ab6-9fbb-dac536245cf2))
(pad "1" thru_hole circle (at 0 0) (size 5 5) (drill 3) (layers "*.Cu" "*.Mask")
(net 121 "GND") (pinfunction "1") (pintype "input") (tstamp f30406da-fc81-4f20-a1ec-f3fae41f4ec1))
(model "${KIPRJMOD}/3d-models/9774010243R.stp"
(offset (xyz 0 0 -1.4))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
(tstamp 338754fc-735e-4690-870d-52f57ccc25d1)
(at 189.5 69 90)
@ -10200,7 +10158,7 @@
(footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
(tstamp 6c2cc4e7-b560-45b9-9648-070ce1f9aa98)
(at 173.6 63.37 -90)
(at 188.3 60.57 -90)
(descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
(tags "resistor")
(property "LCSC" "DNP")
@ -18044,7 +18002,7 @@
(footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
(tstamp 95f0c41c-e07a-4e8f-929a-09717ce901c8)
(at 177.42 62.92)
(at 192.12 60.12)
(descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
(tags "resistor")
(property "LCSC" "DNP")
@ -18974,7 +18932,7 @@
(footprint "Resistor_SMD:R_0402_1005Metric" (layer "F.Cu")
(tstamp a217d998-56d7-4cd5-90ae-6efd1981ee14)
(at 175.15 63.37 -90)
(at 189.85 60.57 -90)
(descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
(tags "resistor")
(property "LCSC" "DNP")
@ -22270,7 +22228,7 @@
(footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
(tstamp cd55ec32-0d0e-491a-83e8-3ed2115d1b57)
(at 69.19 61.44 -90)
(at 175.76 61.59 180)
(descr "USB Type-C receptacle for USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf")
(tags "usb usb-c 2.0 pd")
(property "LCSC" "C165948")
@ -22282,15 +22240,15 @@
(property "ki_keywords" "usb universal serial bus type-C USB2.0")
(path "/04124558-3d09-4534-b584-bac490d409a5")
(attr smd)
(fp_text reference "J9" (at -4.3 -4.845 -270 unlocked) (layer "F.SilkS")
(fp_text reference "J9" (at -4.3 -4.845 unlocked) (layer "F.SilkS")
(effects (font (size 0.5 0.5) (thickness 0.1)))
(tstamp 2e8df211-53c5-4703-8f96-8421527cc024)
)
(fp_text value "USB_C_Receptacle_USB2.0" (at 0 5.1 90) (layer "F.Fab")
(fp_text value "USB_C_Receptacle_USB2.0" (at 0 5.1) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a2c41272-a30f-424c-88c6-1687210a931d)
)
(fp_text user "${REFERENCE}" (at 0 0 -270 unlocked) (layer "F.Fab")
(fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp f2e0455d-23ed-4215-88f9-5ac0b8872bd8)
)
@ -22320,47 +22278,47 @@
(stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 1df2888c-490a-4a37-b7cb-207fbc464dd2))
(fp_line (start 4.47 -3.65) (end 4.47 3.65)
(stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp e16abe87-927c-43cc-a1f7-aca84547f252))
(pad "" np_thru_hole circle (at -2.89 -2.6 270) (size 0.65 0.65) (drill 0.65) (layers "*.Cu" "*.Mask") (tstamp f54c5187-be8c-474f-b68f-32ca24fd291e))
(pad "" np_thru_hole circle (at 2.89 -2.6 270) (size 0.65 0.65) (drill 0.65) (layers "*.Cu" "*.Mask") (tstamp 1ec70671-88bb-49aa-8b29-b51ddfba58a5))
(pad "A1" smd rect (at -3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "" np_thru_hole circle (at -2.89 -2.6 180) (size 0.65 0.65) (drill 0.65) (layers "*.Cu" "*.Mask") (tstamp f54c5187-be8c-474f-b68f-32ca24fd291e))
(pad "" np_thru_hole circle (at 2.89 -2.6 180) (size 0.65 0.65) (drill 0.65) (layers "*.Cu" "*.Mask") (tstamp 1ec70671-88bb-49aa-8b29-b51ddfba58a5))
(pad "A1" smd rect (at -3.25 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 121 "GND") (pinfunction "GND") (pintype "passive") (tstamp c08bb9b9-2109-4481-8fe2-bcfb39fff767))
(pad "A4" smd rect (at -2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A4" smd rect (at -2.45 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 150 "Net-(J9-VBUS-PadA4)") (pinfunction "VBUS") (pintype "passive") (tstamp eb907017-040c-4436-8c48-43d858f109e9))
(pad "A5" smd rect (at -1.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A5" smd rect (at -1.25 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 153 "unconnected-(J9-CC1-PadA5)") (pinfunction "CC1") (pintype "bidirectional+no_connect") (tstamp 1215b4f5-2091-47ac-8234-a876d983cea6))
(pad "A6" smd rect (at -0.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A6" smd rect (at -0.25 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 79 "/RUD+") (pinfunction "D+") (pintype "bidirectional") (tstamp 9856a3c7-d80d-4bf5-be9b-07ab9bbcb2c5))
(pad "A7" smd rect (at 0.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A7" smd rect (at 0.25 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 80 "/RUD-") (pinfunction "D-") (pintype "bidirectional") (tstamp 7d973b2c-cfc7-43d9-afa0-545aeff943ce))
(pad "A8" smd rect (at 1.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A8" smd rect (at 1.25 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 158 "unconnected-(J9-SBU1-PadA8)") (pinfunction "SBU1") (pintype "bidirectional+no_connect") (tstamp f3504235-c96c-47b3-bc88-27c583a2086e))
(pad "A9" smd rect (at 2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A9" smd rect (at 2.45 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 150 "Net-(J9-VBUS-PadA4)") (pinfunction "VBUS") (pintype "passive") (tstamp d18abd8f-abd7-4d40-9980-5573ba8b0340))
(pad "A12" smd rect (at 3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "A12" smd rect (at 3.25 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 121 "GND") (pinfunction "GND") (pintype "passive") (tstamp 5088441d-7e74-416b-8191-e30086b16328))
(pad "B1" smd rect (at 3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B1" smd rect (at 3.25 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 121 "GND") (pinfunction "GND") (pintype "passive") (tstamp 5bd0131e-d129-4f77-9fea-8dfa90ebb9d5))
(pad "B4" smd rect (at 2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B4" smd rect (at 2.45 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 150 "Net-(J9-VBUS-PadA4)") (pinfunction "VBUS") (pintype "passive") (tstamp c693cf2e-3fc3-48eb-adac-c7016316d377))
(pad "B5" smd rect (at 1.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B5" smd rect (at 1.75 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 159 "unconnected-(J9-CC2-PadB5)") (pinfunction "CC2") (pintype "bidirectional+no_connect") (tstamp a99825b8-3001-4c44-aea6-6879e6a0a942))
(pad "B6" smd rect (at 0.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B6" smd rect (at 0.75 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 79 "/RUD+") (pinfunction "D+") (pintype "bidirectional") (tstamp 8e87177b-aa85-490a-9d9c-eb3d43951e2f))
(pad "B7" smd rect (at -0.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B7" smd rect (at -0.75 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 80 "/RUD-") (pinfunction "D-") (pintype "bidirectional") (tstamp 3020e348-eea5-4055-819e-b44fcaed887e))
(pad "B8" smd rect (at -1.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B8" smd rect (at -1.75 -4.045 180) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 160 "unconnected-(J9-SBU2-PadB8)") (pinfunction "SBU2") (pintype "bidirectional+no_connect") (tstamp 25d4c011-3fef-4ddf-ad9c-24ebfd5b0575))
(pad "B9" smd rect (at -2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B9" smd rect (at -2.45 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 150 "Net-(J9-VBUS-PadA4)") (pinfunction "VBUS") (pintype "passive") (tstamp 6c6fb781-f5f5-469a-81f1-a7819c819827))
(pad "B12" smd rect (at -3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(pad "B12" smd rect (at -3.25 -4.045 180) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 121 "GND") (pinfunction "GND") (pintype "passive") (tstamp dcf913e4-5906-4512-8e87-dc530bb133f6))
(pad "S1" thru_hole oval (at -4.32 -3.13 270) (size 1 2.1) (drill oval 0.6 1.7) (layers "*.Cu" "*.Mask")
(pad "S1" thru_hole oval (at -4.32 -3.13 180) (size 1 2.1) (drill oval 0.6 1.7) (layers "*.Cu" "*.Mask")
(net 121 "GND") (pinfunction "SHIELD") (pintype "passive") (tstamp 1a48842b-d8a1-42e2-b634-5999d89b26d1))
(pad "S1" thru_hole oval (at -4.32 1.05 270) (size 1 1.6) (drill oval 0.6 1.2) (layers "*.Cu" "*.Mask")
(pad "S1" thru_hole oval (at -4.32 1.05 180) (size 1 1.6) (drill oval 0.6 1.2) (layers "*.Cu" "*.Mask")
(net 121 "GND") (pinfunction "SHIELD") (pintype "passive") (tstamp 45d68716-0f72-4086-bcae-5be385715252))
(pad "S1" thru_hole oval (at 4.32 -3.13 270) (size 1 2.1) (drill oval 0.6 1.7) (layers "*.Cu" "*.Mask")
(pad "S1" thru_hole oval (at 4.32 -3.13 180) (size 1 2.1) (drill oval 0.6 1.7) (layers "*.Cu" "*.Mask")
(net 121 "GND") (pinfunction "SHIELD") (pintype "passive") (tstamp 93a16372-08e8-4f0a-98d5-32c187c01437))
(pad "S1" thru_hole oval (at 4.32 1.05 270) (size 1 1.6) (drill oval 0.6 1.2) (layers "*.Cu" "*.Mask")
(pad "S1" thru_hole oval (at 4.32 1.05 180) (size 1 1.6) (drill oval 0.6 1.2) (layers "*.Cu" "*.Mask")
(net 121 "GND") (pinfunction "SHIELD") (pintype "passive") (tstamp 5d366132-00c2-4cf3-be5e-dd3e7393f2fb))
(model "${KICAD6_3DMODEL_DIR}/Connector_USB.3dshapes/USB_C_Receptacle_HRO_TYPE-C-31-M-12.wrl"
(offset (xyz 0 0 0))
@ -26805,7 +26763,7 @@
(segment (start 68.115 69.975) (end 68.59 70.45) (width 0.2) (layer "F.Cu") (net 78) (tstamp eb4f1943-e7cd-49e7-a39c-974c27deccc2))
(segment (start 120.281802 78.599999) (end 120.999479 77.882322) (width 0.2) (layer "F.Cu") (net 79) (tstamp 513a37ef-a508-4eb4-aaeb-e318f5837fbe))
(segment (start 87.46 78.3) (end 87.759999 78.599999) (width 0.2) (layer "F.Cu") (net 79) (tstamp 68aee437-3ae1-45c6-819c-c951b588565e))
(segment (start 173.6 62.86) (end 173.61 62.85) (width 0.2) (layer "F.Cu") (net 79) (tstamp a2be0eb1-6f82-4c31-946b-d169762b45b3))
(segment (start 188.3 60.06) (end 188.31 60.05) (width 0.2) (layer "F.Cu") (net 79) (tstamp a2be0eb1-6f82-4c31-946b-d169762b45b3))
(segment (start 120.999479 77.882322) (end 120.999479 77.599479) (width 0.2) (layer "F.Cu") (net 79) (tstamp b5a53cfc-4528-400a-a6a5-80422c8da725))
(segment (start 87.759999 78.599999) (end 120.281802 78.599999) (width 0.2) (layer "F.Cu") (net 79) (tstamp c568e11a-06d8-427c-a681-b18ede4d3414))
(via (at 120.999479 77.599479) (size 0.6) (drill 0.3) (layers "F.Cu" "B.Cu") (net 79) (tstamp a74ad50d-4ad6-40ad-89ca-a47f0537e815))
@ -27766,7 +27724,7 @@
(segment (start 200.74 128.25) (end 200.79 128.2) (width 0.2) (layer "F.Cu") (net 122) (tstamp ac7ab48f-23a0-46fb-bdf2-d516baef7fa6))
(segment (start 179.975 137.85) (end 180.25 137.575) (width 0.2) (layer "F.Cu") (net 122) (tstamp b17c2c6b-621f-4db7-be1b-ee0d1d7fc62b))
(segment (start 192.3 101.1625) (end 192.3625 101.1) (width 0.5) (layer "F.Cu") (net 122) (tstamp b40ee481-6ec0-422e-845e-8102816e332a))
(segment (start 177.93 62.92) (end 178.02 62.92) (width 0.8) (layer "F.Cu") (net 122) (tstamp b5b91818-c4a3-4c9e-bdb3-b2b00f155789))
(segment (start 192.63 60.12) (end 192.72 60.12) (width 0.8) (layer "F.Cu") (net 122) (tstamp b5b91818-c4a3-4c9e-bdb3-b2b00f155789))
(segment (start 200.74 125.75) (end 200.79 125.8) (width 0.2) (layer "F.Cu") (net 122) (tstamp b977093d-af23-4aec-953d-2a83e9c921ef))
(segment (start 190.32 88.18) (end 190.8 87.7) (width 0.2) (layer "F.Cu") (net 122) (tstamp baaf274a-7c28-4883-9d98-8c3f1f15d811))
(segment (start 182.9 135.3) (end 185.4 132.8) (width 0.2) (layer "F.Cu") (net 122) (tstamp bed50941-147b-4ac0-9947-c0d7f8772a83))