357 lines
28 KiB
Plaintext
357 lines
28 KiB
Plaintext
(module TE_1473149-4 (layer F.Cu) (tedit 5D2B9F5F)
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(attr smd)
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(effects (font (size 1.40362 1.40362) (thickness 0.05)))
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)
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(fp_text value VAL** (at -31.3998 23.4319) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(pad 155 smd rect (at -18.15 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 158 smd rect (at -19.05 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 159 smd rect (at -19.35 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 163 smd rect (at -20.55 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 164 smd rect (at -20.85 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 165 smd rect (at -21.15 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 167 smd rect (at -21.75 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 168 smd rect (at -22.05 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 169 smd rect (at -22.35 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 170 smd rect (at -22.65 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 171 smd rect (at -22.95 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 172 smd rect (at -23.25 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 174 smd rect (at -23.85 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 175 smd rect (at -24.15 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 182 smd rect (at -26.25 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 184 smd rect (at -26.85 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 185 smd rect (at -27.15 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 188 smd rect (at -28.05 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 189 smd rect (at -28.35 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 192 smd rect (at -29.25 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 193 smd rect (at -29.55 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 194 smd rect (at -29.85 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 195 smd rect (at -30.15 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 196 smd rect (at -30.45 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 197 smd rect (at -30.75 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 198 smd rect (at -31.05 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 199 smd rect (at -31.35 -4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 200 smd rect (at -31.65 4.1 90) (size 2 0.35) (layers F.Cu F.Paste F.Mask))
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(pad Hole np_thru_hole circle (at -33.4 0) (size 1.1 1.1) (drill 1.1) (layers *.Cu *.Mask F.SilkS))
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(pad Hole np_thru_hole circle (at 33.4 0) (size 1.6 1.6) (drill 1.6) (layers *.Cu *.Mask F.SilkS))
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(pad SH1 smd rect (at -32.55 12) (size 4.5 4.6) (layers F.Cu F.Paste F.Mask))
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(pad SH2 smd rect (at 32.55 12) (size 4.5 4.6) (layers F.Cu F.Paste F.Mask))
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)
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